Benutzeranleitung / Produktwartung mPGA604 des Produzenten Intel
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R Docum ent Number : 254239-001 mPGA604 Socket Design Guidelines Revision 1.0 October 2003.
R 2 mPGA604 Socket Des ign G uidelines Notice: This doc umen t contai ns inform ation o n product s in the design p hase o f develo pment. T he inform ation here i s subje ct to chan ge w ithout no tice. Do not finali ze a de sign with this inform ation.
R mPGA604 Socket Des ign G uidelines 3 Contents 1 Introduction ................................................................................................................... .... 9 1.1 Objec tive ..................................................
R 4 mPGA604 Socket Des ign G uidelines 5 Environmental Requirem ents ........................................................................................ 29 5.1 Porosit y Test .......................................................................
R mPGA604 Socket Des ign G uidelines 5 Tables 2-1 Pack age Critical- To-Func tion (CT F) Dim ensions ................................................ 11 3-1 Sock et Critical-to-Funct ion Dim ensions ....................................................
R 6 mPGA604 Socket Des ign G uidelines Re vision Histor y Revision Number Description Date 1.0 • Initial releas e of the document. October 2003.
R mPGA604 Socket Des ign G uidelines 7 Re-Validati on N otice to S ocket Vendor s Any significant change to the socket will require submission of a detailed explanation o f the change at least 60 days prior to the planned implementation.
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R mPGA604 Socket Des ign G uidelines 9 1 Introduction 1.1 Objecti ve This document def ines a surf ace mount, Zero In sertion Force (ZIF ) socket intended for w orkstation and serv er platforms bas ed on future In tel microprocess ors. The socket prov ides I/O, pow er and groun d contacts.
Introduct ion R 10 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 11 2 Assembled Component and Package Description Inform ation provided in this secti on is to ensu re dimension al compatibility of the m PG A604 sock et with that of the 604-pin processor packag e.
Assemb led Com pon ent an d Pack ag e Des cr iptio n R 12 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 13 3 Mechanical Requirements 3.1 Mechanical Sup ports A retention system needs to isolate any load in exces s of 50 lbf, compressive, f rom the socket during the shock and vi bration conditions outlined in Sections 5.
Mechanic al Requir ements R 14 mPGA604 Socket Des ign G uidelines Proper s eating 3.5 Markings All markings required in this section must be able to withsta nd a temperature of 240 ° C f or 40 second.
R Mechanic al Requir ements mPGA604 Socket Des ign G uidelines 15 3.6 Socket Size The socket size must m eet the di mensions as shown in Figure A-5 and Figure A-6, allow ing full insertion of the pins in the socket, without interference between the socket and the pin field.
Mechanic al Requir ements R 16 mPGA604 Socket Des ign G uidelines 3.9.6 Lubricants For the final assembled prod uct, no lubricant is per mitted on the socket contacts. If lubricants are used elsewhere within the s ocket asse mbly, these lubricants must not be able to migrate to the socket contacts.
R Mechanic al Requir ements mPGA604 Socket Des ign G uidelines 17 3.16 Critical-to -Function Dime nsion s The mPGA604 s ocket shall accept a 604-pin processor pin f ield.
Mechanic al Requir ements R 18 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 19 4 Electrical Requirements Socket electrical requirements are m easured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket P CB to which it is attached.
Electr ical Requ irements R 20 mPGA604 Socket Des ign G uidelines 4.1 Electrical Resis tance Figure 4- 1 and Figu re 4-2 show the proposed m ethodology for measu ring the fi nal electrical resist ance.
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 21 Figure 4-3. Electri cal Resi stance Fi xtures Sup erimp osed.
Electr ical Requ irements R 22 mPGA604 Socket Des ign G uidelines Table 4- 3. Resistanc e Test F ixtures Net list DC Endpoi nts Edgefingers: Hi Edgefingers: L ow Daisy Chain # of pins per chain Hi Low.
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 23 Table 4- 3. Resistanc e Test F ixtures Net list (Cont inued) DC Endpoi nts Edgefingers: Hi Edgefingers: L ow Daisy Chain # of pins per.
Electr ical Requ irements R 24 mPGA604 Socket Des ign G uidelines 4.2 Determination of Maximum Elec trical Resistanc e This section provides a guideli ne for the instruments used to take the measurements. Note: The inst rument sel ection should con sider the gu idelines in EIA 364-23A .
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 25 Figure 4-4. Inductance Measur ement Fixture Cross-Section No Plane o n this La yer Full Plane on this Layer Socke t Inter poser Mother.
Electr ical Requ irements R 26 mPGA604 Socket Des ign G uidelines 4. Calibration – Cascade Ca libration Substrates or eq uivalent. 5. Measurement objects – pack ages, sockets , motherboards.
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 27 for the socket. The shou lder of the interposer is not included in the electrical modeling. If there is any diff erence between them, it will be called the de-em bedded correction factor.
Electr ical Requ irements R 28 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 29 5 Environmental Requirements Design, including materials, shall be con sistent with the manufacture of units that meet the followi ng environm ental referen ce points . The reliability targets in this s ection are based on the expected field use environment for a desktop product.
Environme ntal Re quireme nts R 30 mPGA604 Socket Des ign G uidelines Table 5-1. Use Conditions Environment (Continued) Use Environment Speculative Stress Condition 7 Year Life Expectation 10 Year Life Expectation Fast, large gradient on/off to max operating tem p.
R Environme ntal Re quireme nts mPGA604 Socket Des ign G uidelines 31 5.5 Durabilit y Use per EIA 364, test proce dure 09B. The s ame package pi n field is to be used f or 1st and 51st cycles. Measure cont act resistance when mated in 1st and 51st cy cles.
Environme ntal Re quireme nts R 32 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 33 6 Validation Testing Requirements This section of the docu ment outlines the tests that must b e success full y completed in order for the supplier's s ocket to pass the design gu idelines validation. It provides the test plan an d procedure required for validation.
Validati on Testing Require ments R 34 mPGA604 Socket Des ign G uidelines 6.7 Qualit y A ssura nce Requirem ents The OEM’s will work with the socket supp lier(s) the y choose to ensure socket quality.
R mPGA604 Socket Des ign G uidelines 35 7 Safety Requirements Design, including materials, shall be con sistent with the manufacture of units that meet the follo wing safe t y stand ards: • UL 1950 m ost current editions. • CSA 950 m ost current edition.
Safety Req uirements R 36 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 37 8 Documentation Requirements The socket supplier shall pro vide Intel with the following documentation: • Multi-Line Coupled SPICE models for socket. • Product design guideli ne incorporating the requirements o f these design guideline s.
Documentat ion Re quireme nts R 38 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
R mPGA604 Socket Des ign G uidelines 39 A Appendix A Figure A-1. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 1 of 3).
Append ix A R 40 mPGA604 Socket Des ign G uidelines Figure A-2. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 2 of 3).
R Append ix A mPGA604 Socket Des ign G uidelines 41 Figure A-3. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 3 of 3).
Append ix A R 42 mPGA604 Socket Des ign G uidelines Figure A-4. mPG A604 Socket Draw ing (Sheet 1 of 3).
R Append ix A mPGA604 Socket Des ign G uidelines 43 Figure A-5. mPG A604 Socket Draw ing (Sheet 2 of 3).
Append ix A R 44 mPGA604 Socket Des ign G uidelines Figure A-6. mPG A604 Socket Draw ing (Sheet 3 of 3).
R Append ix A mPGA604 Socket Des ign G uidelines 45 Figure A-7. 603-Pin Interp oser Assembly Draw ing ( Sheet 1 of 7).
Append ix A R 46 mPGA604 Socket Des ign G uidelines Figure A-8. 603-Pin Interp oser Assembly Draw ing ( Sheet 2 of 7).
R Append ix A mPGA604 Socket Des ign G uidelines 47 Figure A-9. 603-Pin Interp oser Assembly Draw ing ( Sheet 3 of 7).
Append ix A R 48 mPGA604 Socket Des ign G uidelines Figure A-10. 603-Pin Inter poser Assembly Draw ing ( Sheet 4 of 7).
R Append ix A mPGA604 Socket Des ign G uidelines 49 Figure A-11. 603-Pin Inter poser Assembly Draw ing ( Sheet 5 of 7).
Append ix A R 50 mPGA604 Socket Des ign G uidelines Figure A-12. 603-Pin Inter poser Assembly Draw ing ( Sheet 6 of 7).
R Append ix A mPGA604 Socket Des ign G uidelines 51 Figure A-13. 603-Pin Inter poser Assembly Draw ing ( Sheet 7 of 7).
Append ix A R 52 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k ..
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